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| NTLJD2105L POWER MOSFET 8 V, 4.3 A, mCool] High Side Load Switch with Level Shift, 2x2 mm WDFN Package Features * WDFN 2x2 mm Package with Exposed Drain Pads Offers Excellent * * * * * * * Thermal Performance Low RDS(on) P-Channel Load Switch with N-channel MOSFET for Level Shift N Channel Operated at 1.5 V Gate Drive Voltage Level P Channel Operated at 1.5 V Supply Voltage Same Footprint as SC88 Low Profile (<0.8 mm) Allows it to Fit Easily into Extremely Thin Environments ESD Protection These are Pb-Free Devices VINMAX http://onsemi.com RDS(on) MAX 50 mW @ 4.5 V 20 V 60 mW @ 2.5 V 80 mW @ 1.8 V 115 mW @ 1.5 V 4 Q2 6 2, 3 4.3 A IL MAX Applications * High Slide Load Switch with Level Shift * Optimized for Power Management in Ultra Portable Equipment MOSFET(Q2) MAXIMUM RATINGS (TJ = 25C unless otherwise stated) Parameter Q2 Input Voltage (VDS, P-Channel) Q1 On/Off Voltage (VGS, N-Channel) Continuous Load Current (Note 1) Power Dissipation (Note 1) Continuous Load Current (Note 2) Power Dissipation (Note 2) Pulsed Load Current Steady State Steady State Steady State TA = 25C TA = 85C TA = 25C TA = 25C TA = 85C TA = 25C PD ILM TJ, TSTG IS TL PD IL Symbol VIN VON/OFF IL Value 8 6 4.3 3.1 1.56 2.5 1.8 0.52 20 -55 to 150 -2.7 260 W W A Unit V V A Pin 1 5 1 Q1 MARKING DIAGRAM 1 2 JN M G 3 6 5 4 WDFN6 CASE 506AZ JN M G = Specific Device Code = Date Code = Pb-Free Package PIN CONNECTIONS A C A C tp = 10 ms Operating Junction and Storage Temperature Source Current (Body Diode) (Note 2) Lead Temperature for Soldering Purposes (1/8" from case for 10 s) S1 1 2 3 D1/G2 6 D1/G2 5 G1 D2 D2 1. Surface-mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces) 2. Surface-mounted on FR4 board using the minimum recommended pad size. D2 4 S2 (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 1 November, 2006 - Rev. 0 Publication Order Number: NTLJD2105L/D NTLJD2105L THERMAL RESISTANCE RATINGS Parameter Junction-to-Ambient - Steady State (Note 3) Junction-to-Ambient - t v 5 s (Note 3) Junction-to-Ambient - Steady State Min Pad (Note 4) Symbol RqJA RqJA RqJA Max 80 38 180 Unit C/W C/W C/W 3. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces). 4. Surface-mounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise specified) Parameter OFF CHARACTERISTICS Q2 Drain-to-Source Breakdown Voltage Q2 Forward Leakage Current V(BR)DSS IFL VGS = 0 V, ID = 250 mA VON/OFF = 0 V, VIN = 8.0 V TJ = 25C TJ = 85C -8.0 0.1 1 100 -0.8 -1.1 nA V V mA Symbol Test Condition Min Typ Max Unit Q1 Gate-to-Source Leakage Current Q1 Diode Forward On-Voltage ON CHARACTERISTICS Q1 ON/OFF Voltage Q1 Gate Threshold Voltage Q2 Input Voltage Q2 Drain-to-Source On Resistance IGSS VSD VDS = 0 V, VGS1 = 6 V IS = -1.0 A, VGS1 = 0 V VON/OFF VGS1(TH) VIN RDS(on) VIN = 4.5 V, IL = 4.0 A VIN = 2.5 V, IL = 3.0 A VIN = 1.8 V, IL = 1.7 A VIN = 1.5 V, IL = 1.2 A VGS1 = VDS1, ID = 250 mA 1.5 0.40 1.8 33 40 60 75 1.0 1.0 8.0 1.0 8.0 50 60 80 115 A V V mW Q2 Load Current IL VDROP v 0.2 V, VIN = 2.5 V, VON/OFF = 1.5 V VDROP v 0.3 V, VIN = 1.8 V, VON/OFF = 1.5 V http://onsemi.com 2 NTLJD2105L TYPICAL PERFORMANCE CURVES (TJ = 25C unless otherwise noted) 0.15 VIN = 4.5 V VDROP, VOLTAGE DROP (V) VDROP, VOLTAGE DROP (V) 0.15 0.20 VIN = 2.5 V 0.10 TJ = 25C TJ = 25C 0.10 TJ = 85C 0.05 0.05 TJ = 85C 0.00 0 1 2 3 4 0.00 0 1 2 3 4 IL, LOAD CURRENT (AMPS) IL, LOAD CURRENT (AMPS) Figure 1. Voltage Drop versus Load Current @ VIN = 4.5 V 0.25 VIN = 1.8 V VDROP, VOLTAGE DROP (V) 0.20 TJ = 25C 0.15 VDROP, VOLTAGE DROP (V) 0.30 0.25 0.20 0.15 0.35 Figure 2. Voltage Drop versus Load Current @ VIN = 2.5 V VIN = 1.5 V TJ = 25C 0.10 TJ = 85C TJ = 85C 0.10 0.05 0.00 0 1 2 3 4 0.05 0.00 0 1 2 3 4 IL, LOAD CURRENT (AMPS) IL, LOAD CURRENT (AMPS) Figure 3. Voltage Drop versus Load Current @ VIN = 1.8 V Figure 4. Voltage Drop versus Load Current @ VIN = 1.5 V http://onsemi.com 3 NTLJD2105L TYPICAL PERFORMANCE CURVES (TJ = 25C unless otherwise noted) Figure 5. Turn-on (Vin = 1.5 V, RL = 3 W, R1 = 1 kW, R2 = 0, C1 = 47 nF) Figure 6. Turn-off (Vin = 1.5 V, RL = 3 W, R1 = 1 kW, R2 = 0, C1 = 47 nF) Figure 7. Turn-on (Vin = 1.5 V, RL = 3 W, R1 = 10 kW, R2 = 1 kW, C1 = 47 nF) Figure 8. Turn-off (Vin = 1.5 V, RL = 3 W, R1 = 10 kW, R2 = 1 kW, C1 = 47 nF) Figure 9. Turn-on (Vin = 3 V, RL = 3 W, R1 = 10 kW, R2 = 1 kW, C1 = 47 nF) Figure 10. Turn-off (Vin = 3 V, RL = 3 W, R1 = 10 kW, R2 = 1 kW, C1 = 47 nF) http://onsemi.com 4 NTLJD2105L TYPICAL PERFORMANCE CURVES (TJ = 25C unless otherwise noted) EFFECTIVE TRANSIENT THERMAL RESISTANCE 1000 100 D = 0.5 0.2 0.1 10 0.05 0.02 0.01 1 SINGLE PULSE 0.1 0.000001 0.00001 0.0001 0.001 P(pk) D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TA = P(pk) RqJA(t) 10 100 1000 t1 t2 DUTY CYCLE, D = t1/t2 0.01 0.1 t, TIME (sec) 1 Figure 11. Thermal Response VIN R1 4 Q2 6 2, 3 C1 6 VOUT ON/OFF CI 5 Q1 1 R2 CO LOAD GND GND Figure 12. Load Switch Application Components R1 R2 Description Pull-up Resistor Typical 10 kW to 1.0 W* Value AAAAAAAAAAAAAAAAAAA A A A AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA A AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA A A A AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA A A A AAAAAAAAAAAAAAAAAAA A A AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA A A AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAA Optional Slew-Rate Control Output Capacitance Typical 0 kW to 100 kW* Usually < 1.0 mF CO, CI C1 Optional In-Rush Current Control Typical v 1000 pF *Minimum R1 value should be at least 10 x R2 to ensure Q1 turn-on. ORDERING INFORMATION Device NTLJD2105LTBG Package WDFN6 (Pb-Free) Shipping 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NTLJD2105L PACKAGE DIMENSIONS WDFN6, 2x2 CASE 506AZ-01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. PINS 2 & 3 CONNECTED TO LARGE FLAG. 6. PIN 6 CONNECTED TO SMALL FLAG. DIM A A1 A3 b D D2 D3 E E2 e G G2 K L MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.25 0.35 2.00 BSC 0.30 0.50 0.80 1.00 2.00 BSC 0.90 1.10 0.65 BSC 0.41 REF 0.085 REF 0.25 REF 0.20 0.30 PIN ONE REFERENCE E 2X 0.10 C 2X 0.10 C 0.10 C 6X 0.08 C G2 D3 6X L 1 3 NOTE 6 6X K D2 mCool is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative III III III A3 A1 e 4X 2X A C SEATING PLANE SOLDERING FOOTPRINT* 2.30 1.05 0.45 1 6X 0.35 0.38 E2 0.65 PITCH 0.11 B 0.95 6X NOTE 5 6 4 6X b 0.10 C A 0.05 C NOTE 3 G BOTTOM VIEW 0.43 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NTLJD2105L/D |
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